Posted by Webmaster on 2. July 2012 17:33
The Building Envelope and Windows R&D Program is happy to announce another workshop to engage program stakeholders: The “U.S. DOE Technical Analysis Workshop for Window Attachments” will take place at the Holiday Inn Washington National Airport, July 16-17, 2012. The purpose of this meeting is to work with key stakeholders to identify what is needed and what is available to properly characterize window attachment performance, including test procedures, simulation programs, indices of performance, and product categories. For more information, please see the draft agenda below.
If you are interested in attending this workshop, please send an email to email@example.com indicating your interest. Meeting participants will be welcomed on a first come, first served basis!
Attachment stakeholder meeting Agenda_DRAFT_6.22.12.pdf (132.91 kb)
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